Part Number Hot Search : 
N60UFD 02P01240 FDMQ8203 DS1220AD H11L1SM 25A12 M200V8X1 CXT4033
Product Description
Full Text Search
 

To Download S2SA1774G Datasheet File

  If you can't view the Datasheet, Please click here to try to view without PDF Reader .  
 
 


  Datasheet File OCR Text:
  ? semiconductor components industries, llc, 2012 september, 2012 ? rev. 9 1 publication order number: 2sa1774/d 2sa1774g, S2SA1774G pnp silicon general purpose amplifier transistor this pnp transistor is designed for general purpose amplifier applications. this device is housed in the sc ? 75/sot ? 416/sc ? 90 package which is designed for low power surface mount applications, where board space is at a premium. features ? reduces board space ? high h fe , 210 ? 460 (typical) ? low v ce(sat) , < 0.5 v ? available in 8 mm, 7 ? inch/3000 unit tape and reel ? s prefix for automotive and other applications requiring unique site and control change requirements; aec ? q101 qualified and ppap capable ? these devices are pb ? free, halogen free/bfr free and are rohs compliant* maximum ratings (t a = 25 c) rating symbol value unit collector ? emitter v oltage v (br)cbo ? 60 vdc collector ? base voltage v (br)ceo ? 50 vdc emitter ? base voltage v (br)ebo ? 6.0 vdc collector current ? continuous i c ? 100 madc thermal characteristics characteristic symbol max unit power dissipation (note 1) p d 150 mw junction t emperature t j 150 c storage temperature range t stg ? 55 ~ + 150 c stresses exceeding maximum ratings may damage the device. maximum ratings are stress ratings only. functional operation above the recommended operating conditions is not implied. extended exposure to stresses above the recommended operating conditions may affect device reliability. 1. device mounted on a fr ? 4 glass epoxy printed circuit board using the minimum recommended footprint. *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting t echniques reference manual, solderrm/d. marking diagram http://onsemi.com collector 3 1 base 2 emitter sc ? 75 case 463 style 1 1 f9 = device code m = date code*  = pb ? free package (note: microdot may be in either location) *date code orientation may vary depending upon manufacturing location. f9 m   device package shipping ? ordering information 2sa1774g sc ? 75 (pb ? free) 3,000/t ape & reel ?for information on tape and reel specifications, including part orientation and tape sizes, please refer to our tape and reel packaging specifications brochure, brd801 1/d. 2sa1774t1g sc ? 75 (pb ? free) 3,000/t ape & reel S2SA1774G sc ? 75 (pb ? free) 3,000/t ape & reel
2sa1774g, S2SA1774G http://onsemi.com 2 electrical characteristics (t a = 25 c) characteristic symbol min typ max unit collector ? base breakdown voltage (i c = ? 50  adc, i e = 0) v (br)cbo ? 60 ? ? vdc collector ? emitter breakdown v oltage (i c = ? 1.0 madc, i b = 0) v (br)ceo ? 50 ? ? vdc emitter ? base breakdown v oltage (i e = ? 50  adc, i e = 0) v (br)ebo ? 6.0 ? ? vdc collector ? base cutoff current (v cb = ? 30 vdc, i e = 0) i cbo ? ? ? 0.5 na emitter ? base cutoff current (v eb = ? 5.0 vdc, i b = 0) i ebo ? ? ? 0.5  a collector ? emitter saturation voltage (note 2) (i c = ? 50 madc, i b = ? 5.0 madc) v ce(sat) ? ? ? 0.5 vdc dc current gain (note 2) (v ce = ? 6.0 vdc, i c = ? 1.0 madc) h fe 120 ? 560 ? transition frequency (v ce = ? 12 vdc, i c = ? 2.0 madc, f = 30 mhz) f t ? 140 ? mhz output capacitance (v cb = ? 12 vdc, i e = 0 adc, f = 1 mhz) c ob ? 3.5 ? pf 2. pulse test: pulse width 300  s, d.c. 2%.
2sa1774g, S2SA1774G http://onsemi.com 3 typical electrical characteristics figure 1. collector ? emitter saturation voltage vs. collector current 1 0.1 0.01 0.1 1.0 10 100 1000 i c , collector current (ma) v ce , collector ? emitter saturation voltage (v) t a = 150 c t a = 25 c t a = ? 55 c i c /i b = 10 figure 2. base ? emitter saturation voltage vs. collector current 1.2 0.1 1.0 10 100 1000 i c , collector current (ma) v be(sat) , base ? emitter saturation voltage (v) 1.1 1 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 t a = ? 55 c i c /i b = 10 t a = 25 c t a = 150 c figure 3. dc current gain vs. collector current 1000 0.1 1.0 10 100 1000 i c , collector current (ma) h fe , dc current gain t a = 150 c t a = 25 c t a = ? 55 c v ce = 6 v figure 4. saturation region 2.0 i b , base current (ma) v ce(sat) , collector ? emitter saturation voltage (v) 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0 0.1 1.0 10 100 0.01 i c = 100 ma i c = 50 ma i c = 30 ma i c = 10 ma t a = 25 c figure 5. base ? emitter turn ? on voltage vs. collector current 1 0.1 1.0 10 100 1000 i c , collector current (ma) v be(on) , base ? emitter on voltage (v) t a = 150 c t a = 25 c t a = ? 55 c v ce = 2 v figure 6. capacitance 100 v r , reverse voltage (v) c, capacitance (pf) 0.1 1.0 10 100 10 1 c ibo c obo 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 100 10
2sa1774g, S2SA1774G http://onsemi.com 4 typical electrical characteristics figure 7. current gain bandwidth product vs. collector current 1000 i c , collector current (ma) f tau , current gain bandwidth product (mhz) 0.1 1.0 10 100 v ce = ? 2 v t a = 25 c 100 10 1000 figure 8. safe operating area 1000 v ce , collector emitter voltage (v) i c , collector current (ma) 1.0 10 100 10 ms 100 ms 1 ms thermal limit single pulse test at t a = 25 c 100 10 1
2sa1774g, S2SA1774G http://onsemi.com 5 package dimensions style 1: pin 1. base 2. emitter 3. collector sc ? 75/sot ? 416 case 463 issue f notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. m 0.20 (0.008) d ? e ? ? d ? b e 3 pl 0.20 (0.008) e c l a a1 3 2 1 h e dim min nom max millimeters a 0.70 0.80 0.90 a1 0.00 0.05 0.10 b c 0.10 0.15 0.25 d 1.55 1.60 1.65 e e 1.00 bsc 0.027 0.031 0.035 0.000 0.002 0.004 0.004 0.006 0.010 0.059 0.063 0.067 0.04 bsc min nom max inches 0.15 0.20 0.30 0.006 0.008 0.012 h e l 0.10 0.15 0.20 1.50 1.60 1.70 0.004 0.006 0.008 0.061 0.063 0.065 0.70 0.80 0.90 0.027 0.031 0.035 0.787 0.031 0.508 0.020 1.000 0.039  mm inches  scale 10:1 0.356 0.014 *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting t echniques reference manual, solderrm/d. soldering footprint* 1.803 0.071 on semiconductor and are registered trademarks of semiconductor components industries, llc (scillc). scillc reserves the right to mak e changes without further notice to any products herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for an y particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, in cluding without limitation special, consequential or incidental damages. ?typical? parameters which may be provided in scillc data sheets and/or specifications can and do vary in different a pplications and actual performance may vary over time. all operating parameters, including ?typicals? must be validated for each customer application by customer?s technical e xperts. scillc does not convey any license under its patent rights nor the rights of others. scillc products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the scillc prod uct could create a s ituation where personal injury or death may occur. should buyer purchase or use scillc products for any such unintended or unauthorized application, buyer shall indem nify and hold scillc and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney f ees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that scillc was neglig ent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resale in any manner. publication ordering information n. american technical support : 800 ? 282 ? 9855 toll free usa/canada europe, middle east and africa technical support: phone: 421 33 790 2910 japan customer focus center phone: 81 ? 3 ? 5817 ? 1050 2sa1774/d literature fulfillment : literature distribution center for on semiconductor p.o. box 5163, denver, colorado 80217 usa phone : 303 ? 675 ? 2175 or 800 ? 344 ? 3860 toll free usa/canada fax : 303 ? 675 ? 2176 or 800 ? 344 ? 3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your loc a sales representative


▲Up To Search▲   

 
Price & Availability of S2SA1774G

All Rights Reserved © IC-ON-LINE 2003 - 2022  

[Add Bookmark] [Contact Us] [Link exchange] [Privacy policy]
Mirror Sites :  [www.datasheet.hk]   [www.maxim4u.com]  [www.ic-on-line.cn] [www.ic-on-line.com] [www.ic-on-line.net] [www.alldatasheet.com.cn] [www.gdcy.com]  [www.gdcy.net]


 . . . . .
  We use cookies to deliver the best possible web experience and assist with our advertising efforts. By continuing to use this site, you consent to the use of cookies. For more information on cookies, please take a look at our Privacy Policy. X